Elpida develops thinnest memory device in DRAM industry

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Elpida Memory Inc, Japan’s leading global supplier of Dynamic Random Access Memory (DRAM), and its subsidiary, Akita Elpida Memory, said Wednesday that they have developed the technology to mass manufacture a 0.8mm four-layer DRAM package, the thinnest memory device in the DRAM industry.

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The super thin package consists of four low-power consumption 2-gigabit DDR2 Mobile RAMTM chips and was assembled using Package on Package (PoP) technology. The package is an eco-friendly DRAM solution that will be used in smartphones and tablet PCs to make these and other mobile devices thinner and achieve a higher memory density.

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Elpida spokesman Yoshitaka Kinoshita said: “Given the 1.0mm thickness of previous four-layer PoP made by Elpida and competitors, customers have been using two-layer 0.8mm packages. Thus, for systems that needed an 8-gigabit DRAM density at 0.8mm thickness, the solution has been two layers of 4-gigabit products. But now that a four-layers of 2-gigabit products increases the choices, more flexible system design is possible.”

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Kinoshita also added: “Based on this new technology for mass manufacturing thin PoP products, which brings together Elpida’s small chip Mobile RAM technology and Akita Elpida thin-chip processing and molding technology, a four-layer 0.8mm ultra-thin package has been achieved. Also, the yields and cost are the same as for existing 1.0mm products. The next step is an ultra-thin 0.8mm PoP consisting of four layers of 4-gigabit products.”

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Volume production of the four-layer 0.8mm PoP products is expected to begin in the July-September quarter of 2011.

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Elpida believes the four-layer package can respond to the need not only for greater memory chip thinness but also to customer demand for improvements in memory density and memory configuration.

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PoP technology is used to assemble and test different kinds of semiconductor chips in individual packages. These packages are then stacked atop each other to form a PoP configuration. Since PoP technology enables reductions in mounting space and wire length, the technology is seeing rapidly expanding applications in the mobile device market.

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