Epson develops inkjet semiconductor marking system

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Seiko Epson Corp has launched the IP-2000, a semiconductor marking system that utilizes the inkjet method to print identification data, such as the manufacturer’s name or a production number on the surface of a semiconductor package.

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The IP-2000 uses Epson’s proprietary Micro Piezo technology, which enables direct printing onto semiconductor packages using high-visibility white UV cured ink, also developed by Epson. This method eliminates the danger of cutting into the IC inside the package since engraving is not required. To strengthen the adhesion between the ink and the package surface, the IP-2000 performs a cleaning action prior to ink application. Printing and ultraviolet irradiation are done simultaneously for the purpose of solidifying the ink. This way, the IP-2000 provides an integrated semiconductor package marking process, enabling customers to easily introduce it into their operations.

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Further, printing plates required in the conventional pad method is not needed in the new system, which means that the IP 2000 can easily be used in small lot manufacturing for a wide variety of products.

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